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Tag: Tensor G5

  • Google’s Tensor G5: TSMC Partnership Confirmed by Database Leak

    Earlier reports suggested that Google might change its strategy next year by switching the foundry for the Tensor G5 used in the Pixel 10 series to TSMC’s 3nm process, aligning its manufacturing capabilities with those of Qualcomm and MediaTek. To facilitate this transition, Google plans to expand its R&D center in Taiwan.

    According to Wccftech, recently discovered database information indicates that Google has likely commenced its collaboration with TSMC. Any company dealing with import and export must declare the details and value of their goods to customs. The screenshots show relevant database entries, with the exporter being Google’s Taiwanese subsidiary, including the shipment details for the Tensor G5. The product description mentions “LGA,” an abbreviation for “Laguna Beach.”

    The shipping list shows that the Tensor G5 chip version is “A0,” and “NPI-OPEN” signifies an early version. The system-level test “SLT” indicates that the SoC has undergone some form of validation. Additionally, the device is equipped with 16GB of memory, which is a reasonable configuration for the Pixel 10 series.

    Furthermore, the importer is a company named “Tessolve Semiconductor,” based in India, specializing in semiconductor validation and testing. It appears that Google is sending Tensor G5 samples for validation to potentially save on testing costs.

    Although the Tensor G4 has not yet been released, Google is already working on the Tensor G5. Rumors suggest that Google might opt for TSMC’s second-generation 3nm process, known as “N3E,” to produce the Tensor G5 chips, abandoning Samsung’s SoC design in favor of a fully custom solution.

  • Google Tensor G5 may use TSMC 3nm process node

    This year, Google unveiled the Tensor G3, its inaugural smartphone SoC supporting the AV1 codec, which is employed in its flagship products, the Pixel 8 and Pixel 8 Pro. However, in comparison to Qualcomm’s third-generation Snapdragon 8 and MediaTek’s Dimensity 9300, the Tensor G3 significantly lags, with a widening performance gap that has been a source of disappointment and has compelled Google to seek new directions.

    According to media reports, Google is contemplating adopting TSMC’s 3nm process node, such as the N3E technology, for its Tensor G5. This move would at least bring Google’s SoC manufacturing process in line with Qualcomm and MediaTek. Beyond the manufacturing technique, Google plans to abandon Samsung’s SoC design, focusing instead on a fully customized solution, and may even introduce an internally developed new GPU to enhance the overall performance of the SoC.

    Moreover, Google’s focus extends beyond CPU and GPU performance. How to improve energy efficiency and AI capabilities are also pivotal considerations, as it aims to develop a chip that synergizes more effectively with its software requirements. However, these advancements are not expected until 2025 at the earliest, meaning that Google’s first fully customized SoC might not debut until the Pixel 10 and Pixel 10 Pro.

    As for the upcoming “Zuma Pro” Tensor G4, Google will continue its collaboration with Samsung. Rumored to be a minor update, it will be featured in the Pixel 9 and Pixel 9 Pro. Reports have indicated that the Tensor G4 prototype has been operational on a development platform named “Ripcurrent Pro,” with Samsung’s development department assisting. It might also incorporate elements of the Exynos 2400 design, with both being manufactured using the 4LPP+ process.

    Google has no plans to switch its foundry for the Tensor G4, not only due to timing but also due to cost considerations, as the expense of transitioning to TSMC’s 3/4nm process at this stage is prohibitively high.

  • Google will launch a completely self-designed chip in 2025 and use TSMC’s 3nm process

    Google began deploying its proprietary Google Tensor chip with the Pixel 6, diverging from the traditional Qualcomm Snapdragon. Though marketed as an in-house chip, the Google Tensor is in fact a customized variant of Samsung’s Exynos, augmented by Google’s specialized modules, such as a Neural Processing Unit (NPU) designed to enhance the device’s AI capabilities. Consequently, it employs the same manufacturing process as Exynos, bearing the hallmark of Samsung’s technology. As reported by Liliputing, citing information from The Information, Google plans to launch a chip entirely of its own design, anticipated to debut as the Google Tensor G5 in 2025.

    The report suggests that Google initially planned to implement its self-designed chip in 2024, but the project demanded a longer timeline than expected. The first iteration of this chip was produced in limited quantities, for testing and refinement by engineers. Thus, the aforementioned Google Tensor G5 will essentially be the second generation of Google’s in-house chips. Barring any significant disruptions, this chip is expected to feature in the Pixel 10 series according to the current schedule. Moreover, having full design autonomy over the chip will allow Google greater flexibility in its choice of the manufacturing process. The report indicates that the Google Tensor G5 is likely to utilize TSMC’s 3nm process, as opposed to the 5nm process used by Samsung in the Google Tensor G2 currently deployed in devices such as the Pixel 7.

    So, what chip will be used in new Pixel devices before the arrival of the Google Tensor G5? The report provides some insight: subsequent iterations of the Google Tensor chip (potentially dubbed Google Tensor G3, etc.) will be more than mere customizations of Samsung’s design. Google is gradually replacing components within the chip to increase the proportion of Google’s design within the chip.