AMD launches Milan-X with 3D V-Cache
AMD has announced at this year’s Taipei Computer Show that it will launch the Zen 3 Ryzen processor with 3D V-Cache. The CCD used by AMD’s EPYC processor is exactly the same as the...
Tagged: AMD Milan-X
AMD may provide X3D package for EPYC Milan processor, up to 64 cores
More than a year ago, AMD released the Milan EPYC 7003 series processors for data centers and servers. And now there are rumors that AMD is preparing to add their new 3D die stack...
AMD X3D packaged processors are coming, Milan-X will use this packaging method
In fact, as early as last year, AMD’s circuit diagram revealed the X3D packaging method. It is a combination of 2.5D and 3D stacking packages, which can package various chips together as compactly as...
