Intel Ignites Semiconductor Revolution with New Mexico’s Fab 9 Launch

Intel has announced the commencement of operations at its Fab 9 factory located in Rio Rancho, New Mexico, USA. This marks a segment of Intel’s $3.5 billion investment aimed at advancing semiconductor packaging technologies, including the Foveros 3D packaging, offering flexible manufacturing options that optimize power, performance, and cost.

Intel‘s Senior Vice President and Chief Global Operations Officer, Keyvan Esfarjani, stated, “Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation.”

The Fab 9 and Fab 11x factories represent Intel’s first operational bases to extensively utilize 3D advanced packaging technologies and mark the establishment of Intel’s inaugural high-volume advanced packaging factory. This signifies the creation of a more efficient supply chain from demand to final product. Intel’s investment in the region has generated hundreds of high-tech job opportunities, over 3,000 construction jobs, and an additional 3,500 jobs for the state.