Team Group announced that it will participate in Computex 2024 with the theme “Elevate Gaming, Empower AI,” bringing users next-generation, high-specification storage solutions designed to meet the diverse demands of the market with exceptional...
Earlier reports indicated that Samsung’s HBM3E chips encountered significant issues during NVIDIA’s verification tests, including overheating and excessive power consumption. Since last year, Samsung has been providing HBM3 and HBM3E chips to NVIDIA for...
Last July, mid-August, and early October, Micron, SK Hynix, and Samsung successively provided NVIDIA with 8-layer vertically stacked HBM3E (24GB) samples. Among them, Micron and SK Hynix’s HBM3E passed NVIDIA’s verification early this year...
The mainstream memory in the industry is currently transitioning to DDR5, and over the past two years, speeds have soared at an astonishing rate. Initially, at 4.8 Gbps, speeds above 6 Gbps are now...
Patriot has announced a collaboration with MSI to launch the new Viper Xtreme 5 RGB DDR5 MPOWER series memory. This high-speed DDR5 memory kit is designed for gamers, overclocking enthusiasts, and high-end users, meeting...
Micron has announced the launch of the LPCAMM2 memory under its Crucial brand, which focuses on consumer storage products. This revolutionary laptop memory, equipped with LPDDR5X chips, enhances the performance of mobile devices for...
In recent years, the demand for High Bandwidth Memory (HBM) has surged dramatically, especially with the rise of the artificial intelligence (AI) boom, making this trend increasingly apparent. Sales of HBM products have climbed...
Micron has announced that it is the first to validate and deliver 128GB DDR5 RDIMM memory modules based on 32Gb DRAM chips on leading server platforms, thereby setting an industry benchmark. These modules are...
Rambus has announced the launch of its new DDR5 RDIMM server memory dedicated PMIC (Power Management Integrated Circuit). This new series of server PMICs provides a complete chipset solution for DDR5 RDIMM memory modules,...
Today, Kioxia announced the debut of its latest generation UFS 4.0 flash memory chips, offering new products in 256GB, 512GB, and 1TB capacity specifications, designed for use in next-generation mobile applications, including high-end smartphones....
At the GTC 2024 conference held at the San Jose Convention Center in California, Jensen Huang, the founder, and CEO of Nvidia, introduced products based on the Blackwell architecture for data centers, which in...
At the beginning of this month, JEDEC established specific standards for GDDR7 memory. At the ongoing GTC 2024, NVIDIA presented only its data center products, omitting any showcase of the Blackwell architecture designed for...
Recently, SK Hynix announced the commencement of mass production of its latest memory product, HBM3E, and plans to supply it to key clients by the end of March. These clients include NVIDIA, which possesses...
High Bandwidth Memory (HBM) products are regarded as one of the cornerstones of artificial intelligence (AI) computing, with the industry witnessing rapid development over the past two years. Under the influence of artificial intelligence...
High Bandwidth Memory (HBM) products are regarded as one of the pillars of artificial intelligence (AI) computing, with the industry experiencing rapid development over the past two years. Influenced by the advancements in artificial...
Recently, JEDEC announced that Dell’s CAMM has officially become a JEDEC standard, christened as “CAMM2.” This heralds an era where an increasing number of laptops will adopt this new memory module design, likely replacing...
