Category: Memory

Samsung AMD agreement

Samsung Rebuts HBM3E Failure Claims, Cites Smooth Testing

Earlier reports indicated that Samsung’s HBM3E chips encountered significant issues during NVIDIA’s verification tests, including overheating and excessive power consumption. Since last year, Samsung has been providing HBM3 and HBM3E chips to NVIDIA for...

Samsung AMD agreement

Samsung’s HBM3E Chips Fail NVIDIA’s Heat Test, Delays Loom

Last July, mid-August, and early October, Micron, SK Hynix, and Samsung successively provided NVIDIA with 8-layer vertically stacked HBM3E (24GB) samples. Among them, Micron and SK Hynix’s HBM3E passed NVIDIA’s verification early this year...

LPDDR6

LPDDR6 Unleashed: Memory Speeds Soar to 14.4 Gbps

The mainstream memory in the industry is currently transitioning to DDR5, and over the past two years, speeds have soared at an astonishing rate. Initially, at 4.8 Gbps, speeds above 6 Gbps are now...

LPCAMM2 memory

Micron launches Crucial 64GB LPCAMM2 LPDDR5X- 7500 memory

Micron has announced the launch of the LPCAMM2 memory under its Crucial brand, which focuses on consumer storage products. This revolutionary laptop memory, equipped with LPDDR5X chips, enhances the performance of mobile devices for...

Samsung AMD agreement

The price of HBM products may increase by 5~10% next year

In recent years, the demand for High Bandwidth Memory (HBM) has surged dramatically, especially with the rise of the artificial intelligence (AI) boom, making this trend increasingly apparent. Sales of HBM products have climbed...

128 GB DDR5 RDIMM

Micron Leads with First 8000 MT/s DDR5 RDIMM for AI

Micron has announced that it is the first to validate and deliver 128GB DDR5 RDIMM memory modules based on 32Gb DRAM chips on leading server platforms, thereby setting an industry benchmark. These modules are...

Rambus DDR5 PMIC

Rambus releases DDR5 server PMIC

Rambus has announced the launch of its new DDR5 RDIMM server memory dedicated PMIC (Power Management Integrated Circuit). This new series of server PMICs provides a complete chipset solution for DDR5 RDIMM memory modules,...

UFS 4.0 flash memory

Next-Gen Smartphones Get a Speed Boost: Kioxia UFS 4.0

Today, Kioxia announced the debut of its latest generation UFS 4.0 flash memory chips, offering new products in 256GB, 512GB, and 1TB capacity specifications, designed for use in next-generation mobile applications, including high-end smartphones....

Samsung GDDR7 memory bandwidth

Samsung showcases new generation GDDR7 memory

At the beginning of this month, JEDEC established specific standards for GDDR7 memory. At the ongoing GTC 2024, NVIDIA presented only its data center products, omitting any showcase of the Blackwell architecture designed for...

SK Hynix HBM3E mass production

SK Hynix HBM3E memory is now in mass production

Recently, SK Hynix announced the commencement of mass production of its latest memory product, HBM3E, and plans to supply it to key clients by the end of March. These clients include NVIDIA, which possesses...

CAMM2 memory desktop

CAMM2 memory module may enter the desktop field

Recently, JEDEC announced that Dell’s CAMM has officially become a JEDEC standard, christened as “CAMM2.” This heralds an era where an increasing number of laptops will adopt this new memory module design, likely replacing...