In response to the significant increase in demand for semiconductors used in artificial intelligence (AI), SK Hynix has previously decided to expand the production capacity of its core AI infrastructure products, such as the...
Recently, SK Hynix announced the development of a new generation mobile NAND flash memory solution, “ZUFS (Zoned UFS) 4.0.” Following its pioneering work in ultra-high-performance DRAM, including HBM, SK Hynix is now leading the...
As the number of layers in 3D NAND technology continues to increase, manufacturers are exploring new production techniques to enhance efficiency. SK Hynix is currently evaluating Tokyo Electron’s latest low-temperature etching equipment, which operates...
Recently, SK Hynix announced the signing of a Memorandum of Understanding (MOU) with Taiwan Semiconductor Manufacturing Company (TSMC), marking a significant collaboration aimed at advancing the production of next-generation HBM products and enhancing the...
Over the past year, the strategy of reducing production by memory suppliers has proven effective, leading to a rebound in the prices of storage products. Reports from last month indicate that the prices of...
SK Hynix has announced plans to establish an advanced packaging production facility in West Lafayette, Indiana, USA, tailored for Artificial Intelligence (AI) storage solutions. This initiative will also involve collaborative semiconductor research and development...
As one of the largest semiconductor companies in the world, SK Hynix has recently emerged from the shadow of a lackluster memory market in 2023, riding the wave of Artificial Intelligence (AI) and High-Performance...
During the Nvidia GTC 2024 conference, SK Hynix captivated attendees with its theme, “Memory, The Power of AI,” showcasing a wide array of products including the 12-layer HBM3E, CXL (Compute Express Link), and PCIe...
Recently, SK Hynix announced the commencement of mass production of its latest memory product, HBM3E, and plans to supply it to key clients by the end of March. These clients include NVIDIA, which possesses...
In the realm of high-bandwidth memory (HBM) markets in 2024, HBM3 remains the prevailing standard, although Nvidia’s forthcoming H200 and B100 are set to transition to HBM3E. The soaring demand for artificial intelligence (AI)...
Influenced by the burgeoning fields of Artificial Intelligence (AI) and High-Performance Computing (HPC), the development of High Bandwidth Memory (HBM) products has accelerated in the past two years, concurrently driving revenue growth for memory...
In 2019, the JEDEC Solid State Technology Association officially unveiled the JESD209-5 standard, known as Low Power Double Data Rate 5 (LPDDR5), marking a significant advancement with speeds reaching 6400MT/s, effectively doubling the rate...
In recent years, the demand for high-bandwidth memory has surged, a trend that has become increasingly pronounced with the advent of the artificial intelligence (AI) boom, leading to a significant rise in HBM product...
High-bandwidth memory (HBM) products are considered one of the cornerstones of artificial intelligence (AI) computation, with the industry experiencing rapid development over the past two years. Influenced by advancements in artificial intelligence and high-performance...
High Bandwidth Memory (HBM) products are regarded as one of the pillars of artificial intelligence (AI) computing, with the industry experiencing rapid development over the past two years. Influenced by the advancements in artificial...
Recently, we reported that Samsung will showcase its latest GDDR7 memory technology at ISSCC 2024, held from February 18 to 22 in San Francisco, USA. This technology boasts a rate of 37Gb/s for 16Gbit...
