Category: News

Samsung Shinkawa

Samsung Poised to Dominate HBM Packaging with Shinkawa Partnership

Recently, Samsung announced the launch of its SAINT technology, an innovation designed to rival TSMC’s CoWoS packaging. This strategic move positions Samsung to compete in the burgeoning artificial intelligence market. Reports suggest that Samsung...

GPU Shipments Q3 2023

GPU Shipments Soar to Record Highs in Q3 2023

Jon Peddie Research (JPR) recently released its latest GPU market data report, showing that in the third quarter of 2023, the shipment volume of GPUs used in PCs (including both integrated and discrete graphics...

Siemens and Intel to Collaborate

Siemens-Intel Collaboration to Revolutionize Semiconductor Production

Recently, Siemens and Intel signed a Memorandum of Understanding (MoU) to collaborate on advancing the digitalization and sustainability of the microelectronics manufacturing industry. The partnership will focus on shaping the future of manufacturing work,...

DRAM Revenue

DRAM Revenue Skyrockets 18% in Q3, but Q4 Growth Uncertain

TrendForce has released a new research report, revealing that the DRAM industry’s revenue for the third quarter of this year reached approximately $13.48 billion, marking an 18% sequential increase. The latter half of the...

Samsung Galaxy Book 4

Samsung plans to release Galaxy Book 4 series on December 15

Before its official unveiling, the design and specifications of Samsung’s latest generation, the Galaxy Book 4 series of notebooks, were leaked. This series comprises five models, all sharing the same I/O interface design. The...

Qualcomm financial third quarter 2023

Samsung’s 3nm Issues Force Qualcomm to Shift to TSMC

Previous reports indicated that Qualcomm, due to concerns over the limited production capacity of Taiwan Semiconductor Manufacturing Company (TSMC) for 3nm chips, might adopt a dual foundry strategy for its future Snapdragon 8 platform,...