Tagged: Foveros 3D packaging

January 25, 2024

Intel Ignites Semiconductor Revolution with New Mexico’s Fab 9 Launch

Intel has announced the commencement of operations at its Fab 9 factory located in Rio Rancho, New Mexico, USA. This marks a segment of Intel’s $3.5 billion investment aimed at advancing semiconductor packaging technologies,...

CPU

September 27, 2021

Intel has no plans to use 3D packaging technology on Xeon processors

Foveros 3D packaging can be said to be Intel’s most advanced packaging technology, but it is still in the market test stage, only Lakefield processors are in use, and overall shipments are not too...

Tagged: Foveros 3D packaging

Intel Ignites Semiconductor Revolution with New Mexico’s Fab 9 Launch

Intel has no plans to use 3D packaging technology on Xeon processors

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