Intel announced an agreement with Ericsson

Recently, Intel announced a strategic collaboration with Ericsson, the Swedish telecommunications equipment provider, aiming to create customized 5G chips using Intel’s cutting-edge 18A process and manufacturing techniques, thus optimizing the next generation of 5G infrastructure services.

Beyond the creation of bespoke 5G chips, the alliance plans to broaden its collaboration further. They will utilize Intel’s vRAN Boost technology and fourth-generation Intel Xeon Scalable processors to provide solutions for Ericsson’s Cloud RAN. This will help communication service providers increase their network capacity and energy efficiency while also gaining greater flexibility and scalability.

“As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology,” said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. “We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future.”

According to Intel, the 18A is the most advanced technology node in their four-year five-node roadmap. It is designed based on two groundbreaking technologies: RibbonFET and PowerVia. Furthermore, it will offer innovative Ribbon architecture and higher performance in Intel 18A, continuing to reduce metal line width. The development of the Intel 18A process is currently underway and is slated for launch in 2025. Intel harbors high expectations for this technology, viewing it as crucial for reclaiming process superiority.