Arm may become one of the first customers to use Intel 18A process
In April of this year, Intel and Arm forged an agreement, empowering chip designers to craft energy-efficient SoCs utilizing the Intel 18A process. This alliance initially targets SoCs for mobile devices but will soon encompass realms such as autonomous driving, the Internet of Things (IoT), and data centers.
According to Wccftech, Arm collaborates closely with Intel to fine-tune its mobile processor IP design, ensuring seamless integration with the Intel 18A process. It’s posited that both entities are in pursuit of a “hybrid” methodology, one devoid of significant risks, with a propensity for further cost reductions. This venture heralds a paradigm shift for both Arm and Intel and may well recalibrate the industry’s trajectory, with rumors suggesting an upscaling of preliminary shipments.
Amidst the burgeoning advancements in Artificial Intelligence (AI) and High-Performance Computing (HPC), the industry is riding a crescendo of growth, with vast potential lying untapped. Arm aspires to broaden its horizons, eager to transcend its stronghold in the mobile sector.
Intel has previously intimated that the Intel 20A and 18A processes, underpinned by the groundbreaking RibbonFET and PowerVia technologies, will herald the dawn of the Angstrom era. These processes are perceived as pivotal in rivaling TSMC by 2025. The RibbonFET is a realization of the Gate All Around transistor, enhancing transistor switching speeds and delivering drive currents comparable to multi-fin structures, but in a more compact footprint. This marks Intel’s inaugural transistor architecture since the debut of FinFET in 2011. PowerVia, a unique offering from Intel and an industry-first, is a backend power delivery network, optimizing signal transmission by obviating the need for front-side wafer power routing.