CybserSecurity News

Tag: Snapdragon

  • Finally: Windows 11 Tests Shared Bluetooth Audio on Two Devices, Starting with Copilot+ PCs

    Microsoft has begun testing a new feature that enables simultaneous audio playback on two Bluetooth devices. This capability, known as Shared Audio, is integrated into Windows 11 and is based on Bluetooth LE Audio technology.

    As noted in the Windows Insider blog, the feature is already available to members of the Windows 11 Insider Program in Build 26220.7051 (KB5067115) for the Dev and Beta channels.

    LE Audio allows a single audio stream to be transmitted to two devices at once—for example, to a pair of headphones and a speaker. Previously, Bluetooth connections supported only one output device at a time. Now, Windows can broadcast audio simultaneously to two headsets or speakers, provided that both the computer and accessories support LE Audio.

    According to Microsoft, the feature is ideal for “sharing music with a friend or watching a movie together while traveling.” Users can enable Shared Audio (Preview) via the Quick Settings panel in Windows, and stop streaming by selecting Stop Sharing.

    In its initial rollout, the feature is available exclusively on Copilot+ PCs powered by Qualcomm Snapdragon X processors. Supported models include:

    • Surface Laptop 13.8″ and 15″
    • Surface Laptop for Business 13.8″ and 15″
    • Surface Pro 13″
    • Surface Pro for Business 13″

    Microsoft has promised to expand compatibility in the near future, adding support for:

    • Samsung Galaxy Book5 360, Book5 Pro, and Book5 Pro 360 (Intel Core Ultra Series 200)
    • Samsung Galaxy Book4 Edge (Snapdragon X)
    • Surface Laptop and Surface Pro with 12″ and 13″ displays

    The feature also requires compatible Bluetooth audio devices, with confirmed support for Galaxy Buds2 Pro, Buds3, and Buds3 Pro.

    With this addition, Windows 11 gains the long-awaited ability to stream audio to two Bluetooth devices simultaneously—a feature previously available only within mobile ecosystems, now finally arriving on desktop PCs.

  • Qualcomm brings auto-generated AI to Windows 11 On Snapdragon devices

    During the course of Build 2023, Qualcomm, in collaboration with Microsoft, announced the incorporation of generative artificial intelligence technology into Windows 11 on Snapdragon devices. The implementation of this technology will leverage the Snapdragon AIE artificial intelligence engine to propel a wide range of AI applications.

    Qualcomm further divulged plans to enable Snapdragon processor platforms to handle AI models encompassing up to 10 billion parameters within the coming months. This includes the application of expansive natural language models.

    Windows 11 On Snapdragon

    At Build 2023, Qualcomm heralded the opening of AI Engine Direct SDK tool resources, utilizing the Qualcomm AI Stack technology suite, coupled with ONNX Runtime. This allows developers to execute AI workloads on devices equipped with Snapdragon 8cx Gen 3 processors, such as the Surface Pro 9 5G or the Lenovo ThinkPad x13s.

    In addition, Qualcomm announced the unveiling of a new developer portal website, furnishing critical tool resources and offering technical support for the development of applications for Windows on Snapdragon.

  • Snapdragon 8 Gen 4 is rumored to be manufactured using TSMC’s N3E process

    Recent rumors surrounding Qualcomm’s Snapdragon 8 Gen 3 have abounded, such as the introduction of new cores and altered configurations of large and small cores. However, as the chipset continues to utilize TSMC’s 4nm process and does not incorporate custom cores infused with NUVIA technology, the forthcoming Snapdragon 8 series SoC next year has garnered greater interest.

    According to Twitter user @Tech_Reve, the Snapdragon 8 Gen 4 will be manufactured using TSMC’s N3E process, the second iteration of 3nm technology, which offers substantial multi-core performance improvements compared to current processes. Furthermore, Qualcomm will introduce custom cores based on NUVIA technology, eschewing previous Arm-based designs. The Snapdragon 8 Gen 4’s CPU is expected to adopt a 2+6 architecture, with two “Nuvia Phoenix” performance cores paired with six “Nuvia Phoenix M” energy-efficient cores.

    Snapdragon 8 Gen 3

    Reports suggest that bolstered by the new process and cores, the fourth-generation Snapdragon 8’s performance will see a significant increase of up to 40%. Based on such an improvement and factoring in leaked data from the third-generation Snapdragon 8, the fourth-generation model could potentially surpass 9,000 points in Geekbench 5’s multi-threaded benchmark tests, even outperforming Apple’s M2 chip.

    In addition to the Snapdragon 8 Gen 4 designed for smartphones, Qualcomm will also release the fourth-generation Snapdragon 8cx for ultra-thin mobile devices, incorporating custom cores based on NUVIA technology. Previous reports have indicated that Qualcomm’s newly announced Oryon processor will be dubbed the fourth-generation Snapdragon 8cx, codenamed “Hamoa,” and is currently undergoing testing.

  • Thunderberry5 powered by Qualcomm Snapdragon SoC

    Owing to their relatively low cost, SBCs frequently employ inexpensive chips; Raspberry Pi utilizes a Broadcom SoC, while other clones often choose RockChip or MTK chips. However, no SBCs have been seen utilizing the renowned Qualcomm Snapdragon SoC—until now. A French company named MakeMyBoard has unveiled the Thunderberry5, a single-board computer featuring a Qualcomm SoC.

    Image credit: Make My Board / Luigi Grasso

    Touted as the first SBC equipped with a Qualcomm AI-CPU, the Thunderberry5 employs the Qualcomm QCS610 Snapdragon SoC, comprising eight Kryo 460 cores: two high-performance cores clocked at 2.2 GHz and six energy-efficient cores at 1.8 GHz. This configuration far surpasses the Raspberry Pi, and the SoC’s built-in NPU, which supports AI acceleration, is well-suited to the current AI boom.

    In terms of other specifications, the Thunderberry5 features an Adreno 612 GPU, supporting HEVC encoding and decoding up to 4K30, 4GB LPDDR4 RAM, 64GB eMMC 5.1 storage, wireless WiFi, HDMI, DSI display connectivity, and more. It also includes a gyroscope and accelerometer sensors for more complex projects.

    However, further information, photos, pricing, and a release date for the Thunderberry5 remain undisclosed. Given the procurement cost of Qualcomm chips, affordability is unlikely. Raspberry Pi’s use of lower-performance chips is not due to a lack of options but rather a desire to maintain a low selling price. The Thunderberry5 may target makers with AI research needs, but it faces stiff competition from the powerful NVIDIA Jetson in this domain.

  • Nothing CEO: Nothing Phone (2) will be equipped with higher computing performance

    During the recently held MWC 2023, Don McGuire, Senior Vice President, and Marketing Chief of Qualcomm revealed during a conversation with Nothing CEO, Carl Pei, that the next Nothing Phone (2) will be equipped with a Snapdragon 8 series processor to correspond to a higher computing performance.

    Pei revealed in the interview video that, after considering many user feedback, the next Nothing Phone (2) will be designed with higher computing performance, and confirmed that Qualcomm will collaborate with them to adopt Snapdragon 8 series processors.

    However, Pei did not disclose the specific hardware specifications, so it is not yet known whether it will be equipped with last year’s Snapdragon 8 Gen 2 processor or a custom-made product from Qualcomm.

    In a previous interview, Pei did not describe Nothing Phone (2) as a flagship phone, and also stated that they have no plans to compete with Apple’s iPhone Pro or Samsung’s Galaxy Ultra positioning models, but explicitly stated that Nothing will prepare to enter the US market.

  • Qualcomm Launches Snapdragon X75, X72, and X35 5G M.2 and LGA Reference Designs

    Qualcomm has announced the release of the Snapdragon X75, X72, and X35 5G M.2 and LGA reference designs, expanding its product portfolio following its release in February 2022.

    By leveraging the latest and most robust features of the Snapdragon X75, X72, and X35 5G modems and radio frequency systems, Qualcomm provides OEMs with an all-in-one solution to support the development of the next generation of 5G terminals for consumers, covering a wide range of devices from PCs to XR and gaming devices.

    The new reference designs integrate the modem, transceiver, and RF front-end onto a compact circuit board, allowing manufacturers to quickly and efficiently incorporate the functionality of the new Snapdragon modem and RF systems into new products. The Snapdragon X75 and X72 5G reference designs support Sub-6GHz and millimeter-wave bands, while the Snapdragon X35 5G reference design is the first to support 5G NR-Light (3GPP Release 17 RedCap).

    Key features of the reference design portfolio include:

    Certified Turnkey Reference Designs

    These turnkey reference design solutions are optimized for performance and certified to work with 5G networks from all key mobile network operators globally. The Snapdragon X75, X72, and X35 5G Reference Designs are available in M.2 and LGA form factors. With support for a wide range of 5G applications from low power to multi-gigabit, the reference designs are available for use in a variety of product segments such as fixed wireless access, compute, gaming, augmented reality, virtual reality, and more.

    Optimize 5G Development Investment

    Providing design and certification support, OEMs, ODMs, and device manufacturers can develop global 5G module solutions with sub-6 and mmWave at a fraction of the cost available today by saving on engineering time, cost, and effort required to enable 5G connectivity using discrete cellular components.

    Faster Time to Market

    Enables OEMs, ODMs, and device manufacturers to leverage Qualcomm Technologies’ reference designs to accelerate end-product sampling and launch timelines while putting 5G in the hands of the consumer quicker.

    Gautam Sheoran, Vice President of Product Management at Qualcomm, said that the release of the M.2 and LGA reference designs further demonstrates Qualcomm’s technology and commitment to continuous innovation in the connectivity field, bringing 5G technology to the next generation of intelligent networked terminals beyond smartphones. It is reported that the Snapdragon X75, X72, and X35 5G M.2 and LGA reference designs are being sampled to customers, and related solutions are expected to be commercialized starting in the second half of this year.

  • Samsung Galaxy S23 series may all use Qualcomm’s solution

    It was previously reported that Samsung will establish a new team consisting of people from the semiconductor and smartphone divisions, internally named “Dream Platform One Team”. New development work will start in July 2022 in order to achieve a breakthrough in high-end SoCs, hoping to catch up with Apple’s A-series chips in 2025. At the same time Samsung is developing the Exynos 2300, but the situation does not seem optimistic.
    Exynos 2200 Xclipse GPU

    According to Sam Mobile, the Samsung Galaxy S23 series may all use Qualcomm’s solution. The reason is that the Exynos 2300 did not perform as expected, the manufacturing process used has problems with energy efficiency, and Qualcomm’s Snapdragon 8 Gen2 is a better chip overall, with better performance and more power efficiency.

    Samsung released the Galaxy S22 series, 70% of the products are equipped with Qualcomm’s Snapdragon 8 Gen1 platform, and the remaining 30% are the Exynos 2200 platform with AMD RDNA 2 architecture Xclipse 920 GPU, which is not ideal. As Samsung chooses Qualcomm’s solution for high-end smartphones, this will further increase Qualcomm’s high-end SoC market share.

    It is understood that Samsung’s new development team will consist of 1,000 engineers, and the goal is to develop high-end SoCs for the Galaxy S25 series in 2025. For Samsung’s design and mobile divisions, it would be a huge blow if the Galaxy S23 lineup finally switches to Qualcomm’s solution. However, it may be good news for users, who can expect a more comprehensive performance of smartphones, and more unified and in-depth optimization, which can improve the user experience.

  • Next-gen flagship Snapdragon is most likely gonna be called “Snapdragon 8gx Gen1”

    Earlier reports pointed out that Qualcomm is about to launch a new generation SoC-developed code-named SM8450 at the Snapdragon Tech Summit held from November 30 to December 2. Its name is no longer the Snapdragon 898 that has been circulating but changed its name to Snapdragon 8 Gen1. In addition to retaining the Snapdragon title and serial numbers, Gen1 stands for Generation 1, which means the first generation.

    As Qualcomm announced that the Snapdragon brand will develop independently, the content of the announcement also confirmed this information, that is, starting from the latest flagship product Snapdragon 8 series, a new simplified and consistent naming structure is adopted. To make it easier for its customers to discover and select devices using Snapdragon technology, the mobile platform will transition to a single-digit representation of series and algebra.

    According to Twitter user @Za_Raczke, the correct name of the future Snapdragon flagship SoC should be Snapdragon 8Gx Gen1. There is a corresponding icon on the test page of Qualcomm’s official website (the page has been deleted).

    It is understood that Qualcomm’s new generation of high-end SoC is a Kryo 780 Prime (Cortex-X2@3.09GHz), three Kryo 780 Gold (Cortex-A710@2.4GHz and four Kryo 780 Silver (Cortex-A510@1.8GHz). The GPU is Adreno 730, the VPU and DPU are Adreno 665 and Adreno 1195 respectively, and it is also equipped with Snapdragon X65 5G baseband, manufactured by Samsung 4nm process.

  • Qualcomm separated the Qualcomm and Snapdragon brands

    There have been reports that Qualcomm may change the naming method and change the development code to SM8450, which is the so-called Snapdragon 898 to Snapdragon 8 Gen1. At the Snapdragon Technology Summit held from November 30 to December 2, Qualcomm is likely to release a new generation of high-end SoC. Recently, Qualcomm officially issued an announcement, indicating that related rumors will soon become reality.
    Snapdragon 888 Plus 5G

    Qualcomm said that in the past ten years, the Snapdragon platform has grown into a huge technology ecosystem, and devices equipped with the Snapdragon platform provide the latest and most innovative technologies. There are now over 2 billion Snapdragon device users across the globe. At the same time, Qualcomm has expanded its first-class connectivity and device-side AI performance to new product categories, including wearable devices, tablets, XR devices, PCs, and automotive.

    In order to develop Snapdragon into a leading cross-category technology brand, Qualcomm has decided to reform in many ways, including separating the Qualcomm and Snapdragon brands, and Snapdragon will become an independent product brand.

    Qualcomm announced that the Snapdragon brand has entered a new era, which has always represented outstanding performance.

  • The 3rd generation Snapdragon 8cx has been greatly improved

    Qualcomm is currently working hard to develop better performance Qualcomm Snapdragon processors for PCs, including a new chip code-named SC 8280 that may be an upgraded version of 8cx.

    SC8280 has multiple versions, the highest performance version is clocked at 2.7 GHz, with 4 Gold+ cores and 4 Gold cores composed of large and small core designs.

    The company may hope to improve processor performance in this way to compete with Apple, after all, the use of ARM on desktop platforms has gradually become a new trend.

    This processor is likely to be the third-generation Qualcomm Snapdragon 8cx processor, and now the benchmarking website Geekbench shows the processor’s running score data.

    Image: geekbench

    The first-generation Qualcomm Snapdragon 8cx processor single-core running scored 726 points, multi-core running scored 2909 points, which is a huge gap compared to traditional desktop processors such as Intel.

    The second-generation Qualcomm Snapdragon 8cx processor has a single-core score of 794 points and a multi-core score of 3036 points. It is said that Microsoft’s Surface Pro X’s custom chip SQ1 is based on this.

    The newly leaked third-generation Qualcomm Snapdragon 8cx processor has a single-core run of 982 points and a multi-core run of 4918 points. Compared with the previous two generations of products, the performance is indeed greatly improved.

    As a comparison to the Intel i7-1165G7 used by Microsoft Surface Pro 7+, the single-core score is 1358 points and the multi-core score is 5246 points. It seems that the gap between Qualcomm has narrowed.

    But compared with Apple’s M1 processor, it is cruel: M1 single-core 1720 points multi-core 7668 points, which means that the new 3rd generation Snapdragon 8cx is still very far from it.