Intel held groundbreaking ceremony for new fab in Ohio

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Earlier this year, Intel announced that it would invest more than $20 billion to build two new fabs in Ohio, USA. This is part of its IDM 2.0 strategy to meet growing market demand for advanced semiconductors by increasing production capacity, powering Intel’s next-generation products, and meeting the needs of foundry customers.

Image: Intel

A few days ago, Intel held a groundbreaking ceremony for a new fab in Ohio, with Intel CEO Pat Gelsinger, US President Joe Biden, Ohio Governor Mike DeWine, and other federal, state, and local officials also participated in the event. This is the largest single private sector investment in Ohio’s history, and the project is expected to create 3,000 Intel jobs, as well as 7,000 construction jobs, and support tens of thousands of long-term service local supplies in the initial phase and during construction business and partner jobs.

Intel originally planned to hold the groundbreaking ceremony of the new fab on July 22, 2022, but because the US Congress failed to reach an agreement on the passage of the CHIPS Act on time, it decided to postpone the groundbreaking ceremony indefinitely in protest. Under the CHIPS Act, semiconductor manufacturers can receive about $52 billion in subsidies.

Intel also previously committed to an additional $100 million for partnerships with educational institutions to support research initiatives in the region by creating talent pipelines. As the new fab breaks ground, Intel announced the first phase of funding for its Ohio semiconductor education and research program, totaling $17.7 million. This is an education and workforce program focused on semiconductor development, involving higher education institutions including the University of Cincinnati, Central State University, Columbus State Community College, Kent State University, Lorain County Community College, Ohio University, and Ohio State University educational institutions.

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