AMD showcases 3D Chiplet architecture: increases the L3 buffer in the CCD to 96MB Technology AMD showcases 3D Chiplet architecture: increases the L3 buffer in the CCD to 96MB ddos June 1, 2021 AMD has been practicing MCM multi-chip packaging for many years, and they have actually cooperated with TSMC... Read More Read more about AMD showcases 3D Chiplet architecture: increases the L3 buffer in the CCD to 96MB
