Intel showcases latest packaging technology, Integrate high-frequency LPDDR5X into the CPU

Recently, Intel showcased its cutting-edge packaging technologies—EMIB and Foveros, which allow for side-by-side chip integration or a 3D stacking approach. They unveiled a Meteor Lake CPU prototype, integrated with 16GB of Samsung’s high-frequency LPDDR5X-7500 memory, boasting a peak memory bandwidth of 120GB/s—significantly surpassing the current DDR5-5200 and LPDDR5-6400.

While the integration of memory onto CPUs is not novel—Apple already employed it in their M1 and M2 chips, and Intel experimented with it in some of their low-end CPUs—it does present certain advantages. This integration not only enhances the performance of ultraportable devices but also optimizes internal space, potentially making room for larger batteries or additional components. However, such a high level of integration also presents challenges, including the difficulty of hardware upgrades, complex repairs when malfunctions arise, and increased chip heat dissipation. Thus, whether the LPDDR5X-integrated Meteor Lake CPU will reach the market remains uncertain.

Rumors suggest Intel Meteor Lake’s product lineup will span 7W, 9W, 15W, 28W, and 45W, with the integrated GPU boasting up to either 4 or 8 Xe cores. The distribution for the Core Ultra first-generation processors is projected as:

– 7W – 1P+4E / 1P+8E, both with 4 Xe GPU cores
– 9W – 2P+4E / 2P+8E, with 3 or 4 Xe GPU cores respectively
– 15W – 2P+4E / 2P+8E / 4P+8E, with 3, 4, or 7-8 Xe GPU cores respectively
– 28W – 2P+8E / 4P+8E / 6P+8E, with 4-7, 8, and 8 Xe GPU cores respectively
– 45W – 4P+8E / 6P+8E, both with 8 Xe GPU cores

Meteor Lake will leverage a second-generation hybrid architecture: the P-Core will adopt the Redwood Cove architecture, replacing the current Golden Cove, while the E-Core will transition to the Crestmont architecture, superseding Gracemont. Employing a Tile design, distinct modules can be fabricated using various manufacturing nodes, subsequently stacked, and interconnected using the EMIB technology, and encapsulated with Foveros. For Meteor Lake, Intel plans to introduce the Intel 4 process, with rumors also pointing to the adoption of TSMC’s N5 and N6 processes.