Qualcomm’s Mystery Chip: “X1P” Surfaces in Testing

Previously, we reported the potential existence of a lower-spec version of the Snapdragon X Elite. Recent updates from WinFuture indicate that Qualcomm is testing another SoC, codenamed “X1P”, in two variants.

Given that the Snapdragon X Elite bears the SKU “X1E”, the new SoCs, identified in reports with SKUs “X1P”, could tentatively be named Snapdragon X PLUS. Furthermore, these chips are internally coded as X1P44100 and X1P46100, though detailed specifications have yet to be disclosed.

Wccftech suggests that Qualcomm might adopt a product strategy similar to Apple’s, segmenting its Windows platform SoCs into tiers akin to the Apple M3, M3 Pro, and M3 Max chips. Wccftech also speculates that while the Snapdragon X Plus may not compete with the Snapdragon X Elite in performance, Qualcomm could imbue it with unique features to spur consumer interest.

Interestingly, reports indicate that the tested Snapdragon X series SoCs integrate Qualcomm‘s fourth-generation 5G modem, the Snapdragon X65. Should Qualcomm successfully develop these products, we can anticipate a broader range of laptops with integrated 5G connectivity. This development would mark a distinction from Apple’s current offerings, as no Mac notebook model currently features mobile network integration.

Previous reports highlight that the Snapdragon X series is manufactured using TSMC’s 4nm process and boasts a 45TOPS NPU. The integrated Adreno GPU delivers 4.6TOPS of computational performance. These platforms support LPDDR5X memory at 8533 MT/s, with capacities up to 64GB, corresponding to a maximum bandwidth of 136 GB/s. In addition to PCIe 4.0 NVMe SSD and UFS 4.0 storage support, they also accommodate 5G, Wi-Fi 7, and Bluetooth 5.4.