AMD launched the Ryzen 9 7945HX3D mobile processor
Today, AMD has officially unveiled the Ryzen 9 7945HX3D processor, heralding the debut of 3D Vertical Cache (3D V-Cache) technology in mobile processors, initially featured in the ASUS ROG Strix SCAR 17 X3D.
In terms of specifications, the AMD Ryzen 9 7945HX3D processor closely mirrors the desktop R9 7950X3D processor: built upon the Zen4 core architecture, it employs a dual CCD design with 16 large cores and 32 threads. Although the R9 7945HX3D only boasts a TDP of over 55W, consuming just half the power of its desktop counterpart, it still manages to reach a maximum acceleration frequency of 5.4GHz. It also supports PBO overclocking and tuning capabilities to further unleash its performance. In addition, thanks to AMD’s 3D V-Cache stacked cache technology, the processor’s third-level cache capacity reaches 128MB, with the total second plus third-level cache amounting to 144MB.
AMD suggests that one of the R9 7945HX3D’s two CCDs boasts superior frequency performance, while the other is equipped with a sizable 3D V-Cache. The driver can allocate applications to one of the CCDs based on feedback from the operating system. Games are typically given priority to the CCD equipped with 3D V-Cache, where the larger third-level cache within the Die can minimize data and instruction addressing latency to the greatest extent, providing players with enhanced gaming performance.
AMD projects the R9 7945HX3D to be the most potent mobile processor currently available in terms of gaming performance, surpassing the R9 7945HX processor by over 15% under 1080p. When compared with the R9 7945HX, the R9 7945HX3D, backed by 3D V-Cache stacking cache technology, achieves an 11% performance boost in “Tomb Raider” at 70W, and a significant 23% improvement at 40W.
It’s understood that the inaugural notebook featuring the AMD R9 7945HX3D processor, the ASUS ROG Strix SCAR 17 X3D, is expected to officially hit the market on August 22, 2023, although the specific pricing remains undisclosed.
