ASRock B760 Sonic motherboard leaked
As CES 2023 is approaching, more and more manufacturers of B760 series motherboards have been exposed. According to VideoCardz, ASRock will launch a B760 motherboard co-branded with Sonic.
In early November, ASRock cooperated with Japan’s SEGA to launch the Z790 PG SONIC co-branded motherboard, and now they plan to bring this design to the B760 series motherboard. The motherboard is an M-ATX form factor and supports DDR5 and PCI-E 5.0. From the appearance, the Z790 version is very similar to the B760 version in design style. The heat dissipation armor at the I/O of the two motherboards looks almost the same as the M.2 heat dissipation armor. The difference is that the heat dissipation armor above the CPU of the B760 motherboard is also painted in blue, but the Z790 motherboard does not.
ASRock B760M PG Sonic WiFi, Source: VideoCardz
In terms of interface, the ASRock B760 Sonic motherboard has a DP interface, one HDMI port, two antenna ports, one PS/2 keyboard and mouse port, one 2.5G network port, three audio ports, seven USB ports, two of which are USB 2.0 ports and one is Type-C port. The number of interfaces is quite satisfactory. The motherboard has a pre-installed wireless network card, and users can use it after installing the antenna. However, the previously launched Z790 PG SONIC co-branded motherboard does not have a pre-installed wireless network card.
ASRock B760M PG Sonic WiFi, Source: VideoCardz
According to previously leaked information, the PCI-E 4.0 channels of the B760 chipset may increase from 6 to 10 in the B660 chipset, while the number of PCI-E 3.0 channels is halved from 8 to 4. This is similar to the change from the Z690 chipset to the Z790 chipset, the Z790 chipset upgrades eight PCI-E 3.0 lanes to PCI-E 4.0C lanes, and at the same time, the number of USB 3.2 Gen2 x2 ports have been upgraded from four to five, and other than that, the specifications are basically the same. Maybe the B760 chipset will also have an upgrade in the number of USB ports.
