AMD Zen 5 and Zen 6 architecture IPC has improved by more than 10%
Prior to recent developments, reports had already intimated that AMD intended to unveil the innovative Zen 5 architecture in 2024, with associated products potentially being launched in the first half of the year, or even as early as the first quarter. This pioneering Zen 5 architecture will encapsulate three distinct designs: Zen 5, Zen 5 V-Cache, and Zen 5c, and will feature both 4nm and 3nm variants. Recently, revelations from ‘Moore’s Law is Dead‘ shed light on the Zen 5 and Zen 6 architectures.
The core moniker for the Zen 5 architecture is “Nirvana”, while the CCD chips bear the epithet “Eldora”. On the desktop platform, the products corresponding to the Zen 5 architecture belong to the Ryzen 8000 series, codenamed “Granite Ridge”. As per the details provided, the IPC of the Zen 5 architecture is anticipated to surge by an impressive 10-15%+ compared to its Zen 4 counterpart. Within the Zen 5 framework, AMD is introducing a more advanced branch prediction unit. Furthermore, AMD is poised to unveil a 16-core CCX design, which could potentially be aligned with the Zen 5c architecture, emphasizing density and performance/power optimization to achieve superior energy efficiency.
On the desktop front, the “Granite Ridge” codenamed Ryzen 8000 series remains at a peak of 16 cores and 32 threads, maintaining compatibility with the AM5 platform. Rumors suggest that within the Zen 5 architecture, the 4nm process will be reserved for the “Granite Ridge” CPUs and certain APUs, while the avant-garde 3nm process may be earmarked for the “Turin” codenamed server CPUs and specific APUs.
Transitioning to the Zen 6 architecture, its core is christened “Morpheus”, projected for a release in the latter half of 2025, and might encompass both 3nm and 2nm versions. The IPC is predicted to undergo a further ascent, estimated at over 10% when juxtaposed against the Zen 5 architecture. AMD is set to introduce a novel 32-core CCX design, which would presumably correlate with the Zen 6c architecture. Concurrently, AMD will incorporate a cutting-edge packaging technique, stacking CCD atop the IOD.
