AMD X3D packaged processors are coming, Milan-X will use this packaging method

In fact, as early as last year, AMD’s circuit diagram revealed the X3D packaging method. It is a combination of 2.5D and 3D stacking packages, which can package various chips together as compactly as possible. Now we have received more information about AMD X3D packaged chips.

According to various news on Twitter, videocardz said that the first AMD product codenamed in X3D package is Milan-X, it will use Zen 3 core, and will use the stacked multi-chip design Genesis I/O Die, and AMD’s current Epyc Milan processor’s platform code is Genesis.

It is expected that Milan-X will not focus on increase the number of cores, but will mainly focus on increasing CPU bandwidth, as seen from the circuit diagram previously released by AMD. The four 2*2 chips in the middle of the Milan-X schematic diagram should be CCDs, and the surrounding is four sets of stacked chips. It may be that AMD wants to package the I/O Die and HBM video memory on one chip. Of course, this is only a schematic diagram.

In any case, Milan-X is not a consumer-grade product. It is prepared for data centers. This design is still far away from the consumer-grade market. AMD may reveal more information about Milan-X at the keynote speech at the Taipei Computer Show, and the conference will be officially held next week.