Tag: AMD X3D
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AMD X3D packaged processors are coming, Milan-X will use this packaging method
In fact, as early as last year, AMD’s circuit diagram revealed the X3D packaging method. It is a combination of 2.5D and 3D stacking packages, which can package various chips together as compactly as possible. Now we have received more information about AMD X3D packaged chips. According to various news on Twitter, videocardz said that…