AMD officially released EPYC 7003X series processors with 3D V-Cache technology
AMD has officially launched the world’s first data center CPU with 3D chip stacking, the EPYC 7003X series processors with 3D V-Cache technology, codenamed Milan-X. AMD said that the new processor is based on the Zen 3 architecture, equipped with the industry’s largest L3 cache, further expanding the third-generation EPYC series product line, compared with the original EPYC 7003 series, the EPYC 7003X series can deliver a 66% performance boost for a variety of computing workloads.
Through the 3D V-Cache technology, an additional 64MB 7nm SRAM cache can be brought to the CCD, so that the L3 cache capacity of the processor is increased from 32MB to 96MB, and the capacity is tripled. The maximum L3 cache capacity of the EPYC 7003X series CPU is increased to 768MB, and the total L3 cache capacity on a dual-socket system has reached an astonishing 1.5GB.
Dan McNamara, senior vice president, and general manager of AMD’s server business unit said, our latest CPUs with AMD 3D V-Cache technology deliver breakthrough performance for mission-critical technical computing workloads, resulting in better-engineered products and faster time to market.
There are four products in the EPYC 7003X series processors, including EPYC 7773X, EPYC 7573X, EPYC 7473X, and EPYC 7373X. The corresponding core thread numbers are 64 cores and 128 threads, 32 cores and 64 threads, 24 cores and 48 threads, and 16 cores and 32 threads, and the corresponding prices are $8,800, $5,590, $3,900, and $4,185. Since the interface has not changed, it is compatible with existing platforms and can be supported by upgrading the BIOS.
