AMD has mass-produced Zen 3 with 3D cache in mid-November
Although everyone is looking forward to AMD’s Zen 4 architecture processor, it will not be released until the end of next year. What these processors have to face is Intel’s next-generation processor Raptor Lake, and for the 12th-generation Core Alder Lake, AMD has come up with the Zen 3 processor with the 3D cache.
Twitter user @Greymon55 said that AMD’s Zen 3 processors with 3D cache have been mass-produced in mid-November. It takes at least three months for a processor to go on the market from mass production, so AMD is likely to be released at CES in January, and the official listing will have to wait until February.
The new Zen 3 processor uses Chiplet packaging technology combined with chip stacking technology to create a 3D Chiplet architecture, and the 3D vertical cache is the first practice of this technology. It packed a 64MB 7nm SRAM on the CCD of the existing Zen 3 architecture Ryzen 5000 processor. This SRAM is directly stacked on the CCD chip so that the L3 buffer capacity of each CCD can be increased from 32MB to 96MB, which is three times the original capacity.
