TSMC formed a “One Team” team to accelerate the development and mass production of 2nm process
Last year, Dr. C.C. Wei, the President of TSMC (Taiwan Semiconductor Manufacturing Company), confirmed that the 2nm process node would incorporate the Gate-all-around FETs (GAAFET) transistors. The fabrication process will continue to rely on the existing Extreme Ultraviolet (EUV) lithography technology. It’s anticipated that by the close of 2024, preparations for risk production will be finalized, transitioning into mass production by the end of 2025. By 2026, clients can expect to receive the inaugural batch of chips manufactured using the N2 process.
According to Torrent Business, in a bid to cement its leading position in advanced semiconductor fabrication, TSMC has internally formed a dedicated task force named “One Team.” This team is spearheading the development, pilot production, and eventual mass manufacturing of the 2nm process node. This includes simultaneous pilot production at both their Hsinchu Baoshan and Kaohsiung wafer fabrication facilities in Taiwan, with mass production slated for 2025. Comprising this team are not only research and development personnel but also wafer fabrication engineers responsible for initial production.
Establishing a special task force dedicated to a specific process node deviates from TSMC’s traditional modus operandi. Historically, the company would select a single wafer fab for pilot production and subsequently extend the latest semiconductor fabrication techniques to other fabs for large-scale production. The fact that TSMC activated two wafer fabs for the N2 process and then assembled the “One Team” underscores the gravity they’re attaching to this initiative.
Recently, Morris Chang, the founder of TSMC, while inaugurating TSMC’s global research and development center, urged the company’s employees to draw lessons from the historical decline of the British Navy. He cautioned against complacency and pride following the establishment of the new R&D center, to avoid retracing the steps that led to the Navy’s downfall. It’s understood that TSMC currently grapples with dual challenges: a reduced order volume for some mature process nodes and rivals inching closer to its advanced 2/3nm process. Consequently, it’s conceivable that TSMC might make unprecedented adjustments in manpower and production capacity.
TSMC’s officials have affirmed the establishment of the “One Team,” though they have remained reticent about divulging specifics concerning the team’s composition and the projects they’re overseeing.
