SK Hynix expects that HBM3 will have a bandwidth of 665 GB/s
High Bandwidth Memory, also known as HBM DRAM, is a high-performance DRAM based on 3D stack technology, suitable for application scenarios with high memory bandwidth requirements. Although HBM has not become the mainstream DRAM for graphics cards, it is still seen from time to time in fields such as data centers that require high bandwidth. Recently, SK Hynix announced the HBM3 product plan, introducing information such as the upcoming specifications and expected bandwidth.
At present, JEDEC, which formulated the HBM standard, has not officially released the HBM3 standard specification. As the main promoter of HBM, SK Hynix has been committed to the research and development of the next generation of HBM. According to a report by TomsHardware, on SK Hynix’s website, HBM3 products show that they are “under development” and have reached an I/O speed of 5.2 Gbps, provides a bandwidth of 665 GB/s. These two values are higher than the 3.6 Gbps and 460 GB/s of HBM2E, an increase of 44.4% and 44.6% respectively. Of course, this is not the ultimate goal of SK Hynix for HBM3. Other manufacturers have announced that they will expand to 7.2 Gbps I/O speed.