Recently, SK Hynix announced the commencement of mass production of its latest memory product, HBM3E, and plans to supply it to key clients by the end of March. These clients include NVIDIA, which possesses...
In the realm of high-bandwidth memory (HBM) markets in 2024, HBM3 remains the prevailing standard, although Nvidia’s forthcoming H200 and B100 are set to transition to HBM3E. The soaring demand for artificial intelligence (AI)...
Since last year, TSMC, responsible for the manufacturing and packaging of NVIDIA’s AI chips, has experienced a tightening of capacity in advanced packaging. Consequently, TSMC has been relentlessly expanding its 2.5D packaging capacity to...
Currently, Samsung and SK Hynix are engaged in a fierce battle for supremacy in the HBM3 market, both vying to supply this cutting-edge memory to clients including industry giants Nvidia and AMD. Both companies...
In recent months, artificial intelligence tools, led predominantly by ChatGPT, have ignited global fervor, substantially amplifying demand for data center GPUs like NVIDIA’s A100 and H100. This surging demand has strained the advanced packaging...
SK hynix announced that it will participate in CES 2023, which will be held in Las Vegas, USA from January 5 to 8 next year, which is the world’s largest electronics and IT exhibition....
SK hynix announced that it has started mass production of HBM3, which is currently the world’s highest-performance DRAM, and will consolidate its leadership in the high-end DRAM market. Compared with traditional DRAM, HBM is...
Early DIY players should know Rambus as a company. At the turn of the century, Intel was very confident that the RDRAM (Rambus Dynamic Random Access Memory) developed by Rambus was far ahead in...
High Bandwidth Memory, also known as HBM DRAM, is a high-performance DRAM based on 3D stack technology, suitable for application scenarios with high memory bandwidth requirements. Although HBM has not become the mainstream DRAM...
