Rambus introduced the 8.4 Gbps HBM3-Ready Memory Subsystem

Early DIY players should know Rambus as a company. At the turn of the century, Intel was very confident that the RDRAM (Rambus Dynamic Random Access Memory) developed by Rambus was far ahead in technology, RDRAM is designated as the next-generation memory standard after SDRAM. Everyone knows the following story. In the end, RDRAM lost to the supporters of DDR memory led by VIA and withdrew from the PC market. However, Rambus has found its own place in the game console market. Nintendo N64, Sony PlayStation 2, and PlayStation 3 (using the new generation of XDR memory standards) have all seen Rambus. On the technical level, Intel is not wrong. Rambus does have its own uniqueness in memory technology. Over the years, it has gained benefits through patents and technology licensing.

Rambus said its HBM3 memory subsystem reduces the difficulty of ASIC design by fully integrating PHY and digital controllers, and has a built-in hardware-level performance monitor, and supports HBM3 RAS and other functions, as part of the IP authorization, also includes 2.5D packaging and interposer reference design. The solution is based on the widely used HBM2 and will have a complete set of support services to ensure the correct implementation of mission-critical AI/ML and HPC applications.

At present, JEDEC, which formulated the HBM standard, has not officially released the HBM3 standard specification. As the main promoter, SK Hynix announced the HBM3 plan, which is still in the development stage, with a rate of 5.2 Gbps and a bandwidth of 665 GB/s. Of course, this is not the ultimate goal of SK Hynix for HBM3. Prior to this, other manufacturers have announced that they will increase the rate to 7.2 Gbps.