Samsung Exynos 2400 will use I-Cube packaging technology
Recent reports suggest that, with the improved yield of Samsung’s 4nm process, the tech giant is now inclined to incorporate the Exynos 2400 into the Galaxy S24 series. Samsung is likely to reimplement its dual-platform strategy in the forthcoming Galaxy S24 series, which will feature versions equipped with both the Exynos 2400 and the 3rd generation Snapdragon 8, with specific SoC changes contingent upon the region of release.
As per Wccftech, current rumour has it that the Exynos 2400 will employ I-Cube packaging technology, a derivative of Fo-WLP (Fan-out Wafer Level Packaging). However, the final specifications and packaging solution for the Exynos 2400 remain undecided, with deliberations ongoing amongst Samsung’s various departments.
Given Fo-WLP’s ability to enhance performance, reduce power consumption, achieve smaller packaging dimensions, heighten integration levels, and decrease chip thickness, Samsung’s decision to shift to I-Cube likely stems from a desire to curtail costs. Samsung’s I-Cube™ is a heterogenous integration technology, allowing one or more logic chips and multiple High Bandwidth Memory (HBM) chips to be encapsulated into a single chip using a silicon interposer.
The Exynos 2400 CPU is understood to feature a 1+2+3+4 quad-cluster architecture, comprising one ultra-large core (Cortex-X4@3.10GHz), two high-frequency large cores (Cortex-A720@2.90GHz), three low-frequency large cores (Cortex-A720@2.60GHz), and four small cores (Cortex-A520@1.80GHz), resulting in a total of 10 cores. Preliminary leaked test results indicate that, compared to Qualcomm’s 2nd generation Snapdragon 8 (single-core 1556 points/multi-core 4987 points), the Exynos 2400 exhibits equivalent single-core performance and superior multi-core performance, thus demonstrating better overall performance.
