Intel Ponte Vecchio will use OAM module
At the Intel Unleashed event in March this year, Intel CEO Pat Gelsinger talked about the Ponte Vecchio of the Xe-HPC architecture and made a public display. This is a major project that Raja Koduri has been responsible for since he was hired as the chief architect of Intel’s graphics department.
Ponte Vecchio is Intel’s first exascale computing GPU, using Intel’s most advanced packaging technology ever, with more than 100 billion transistors. Its 47 chips include 16 Xe-HPG architecture computing chips, 8 Rambo cache chips, 2 Xe base chips, 11 EMIB connection chips, 2 Xe Link I/O chips, and 8 HBM chips. When Ponte Vecchio is used as an open accelerator module, Intel will use a special liquid-cooled heat dissipation module for heat dissipation. The standard is 600W.
Recently, Igor’s LAB has obtained more information and shared it, so that people can have more knowledge about this chip.
Raja Koduri shows the Xe-HPC 2-Tile packaged version (equivalent to the earlier version of Ponte Vecchio). The same structure on the left and right sides can be seen in the picture.
It is understood that in addition to the 2-Tile package version, there will also be a 1-Tile package version and a 4-Tile package version. Ponte Vecchio’s 47 chips will be manufactured using processes at different nodes, including TSMC’s 7nm or 5nm process, and Intel’s 7nm and 10nm processes, and are integrated with Foveros 3D packages through EMIB. In order to cope with TDP up to 600W or higher, Intel designed a complex heat sink for it.
Ponte Vecchio uses the OAM module, which is an open hardware computing accelerator form an interconnection structure. It has five layers. From bottom to top, they are the bottom plate, the PCB circuit board, the top plate, the water cooling device, and the fixed cover.
