Bluetooth SIG announced the future plans for LE Audio and Bluetooth LE technology

The Bluetooth Special Interest Group unveiled further plans for the future development of LE Audio and Bluetooth LE technology at the pre-exhibition of CEATEC 2023 in Japan. This includes the integration of broader transmission bandwidth, enhanced precision in location information, and support for the 5GHz or 6GHz frequency bands.

The LE Audio technical standard was first introduced at the CES exhibition in early 2020. It was confirmed to utilize the LC3 decoding technology to achieve low power consumption while delivering high-quality audio. Furthermore, it incorporated audio-sharing features and improved connectivity characteristics for devices like hearing aids used by the hearing-impaired. Additionally, it supports the Auracast broadcast mode.

Prior to the CEATEC 2023 exhibition in Japan, it was announced that from 2024 onwards, the corresponding bandwidth for LE Audio technology will be expanded. It is anticipated to increase from the current 2Mbps bandwidth of the 2.4GHz frequency band to 8Mbps, facilitating a higher volume of audio data transmission. Concurrently, there will be an optimized use of the 5GHz or 6GHz unlicensed frequency bands, enhancing wireless transmission flexibility. However, the availability might vary depending on regional regulations. As Taiwan has progressively opened up the 6GHz frequency band corresponding to Wi-Fi 6E, it is anticipated there won’t be significant issues regarding support, though final decisions will be at the discretion of the relevant authorities.

Regarding location accuracy, the latest Bluetooth LE technology will refine the minimum 20-meter location precision down to a mere 20 centimeters. This is expected to allow more Bluetooth positioning devices to provide direction and relative distance with heightened accuracy.