Today Igor’sLAB provided a new rendering of the AM5 socket, showing a lot of similarities to Intel’s socket in terms of the locking mechanism, with a lever that pushes the frame onto the socket. This practice ensures that the pressure is evenly distributed and the operation is simpler. Unlike the LGA 1700 socket, the backplate of the AM5 socket is held together by four screws and socket fixing brackets to ensure that the heat sink is perfectly aligned with the AM5 socket and processor. The design is said to combine the design strength of the AM4 backplane and provide up to 8 anchor points to distribute pressure evenly.
AMD’s next-generation AM5 socket rendering structure is exposed
AMD will launch a Zen 4 architecture processor code-named Raphael in the second half of this year, which belongs to the Ryzen 7000 series, and is also the first product to use the AM5 socket for use with motherboards with 600 series chipsets. As the successor of the AM4 socket, the type of socket will be changed from PGA to LGA, and there will be 1718 pins, so the AM5 socket is also called the LGA 1718 socket. Its structure is square, with an area of 40×40 mm, and its new fixing method was exposed on the Internet a few months ago.
It has been reported that after long-term use, the Intel LGA 1700 socket will bend the CPU due to excessive pressure, thus affecting the cooling effect. The current design of AMD’s AM5 socket may be better than Intel’s LGA 1700 socket.
AMD has recently confirmed that CPU coolers on the AM4 platform will be compatible with products on the AM5 platform. Through the processor contact distribution map of the AM5 socket exposed last year, combined with the Ryzen 7000 series CPU codenamed Raphael, it can be seen that AMD placed the capacitors on the substrate in order to allow more space at the bottom for placing contacts.
The advantage of this is that it can maintain the same size package as the AM4 platform CPU, thus providing better CPU cooler compatibility. In other words, past CPU coolers can continue to be used after changing platforms, especially some high-end models with better cooling performance, avoiding waste and saving resources.
It is understood that if the CPU cooler does not exceed 500g, it can still be installed using the original two-point fixing method. If the CPU cooler exceeds 500g, it is necessary to replace the frame assembly. According to the TDP information of the AM5 platform processor leaked before, the new generation of processors will be divided into six grades: 45W, 65W, 95W, 105W, 125W, and 170W, of which the TDP of 170W requires a water cooling radiator of 280 specifications. The general Raphael processor is between 105W-120W, but the TDP of 120W is also 15W higher than the current AM4 platform configuration.
According to AMD, in addition to the Ryzen 7000 series CPU codenamed Raphael, the Ryzen 6000 series APU codenamed Rembrandt should also land on the AM5 platform later. The difference is that the Ryzen 7000 is based on the Zen 4 architecture core, while the Ryzen 6000 is based on the Zen 3+ architecture core. The new AM5 platform will be the same long-time platform as the AM4 platform.