According to DigiTimes
, AMD CEO Dr. Lisa Su will lead a group of senior executives and plan to visit relevant partners from the end of September to the beginning of November this year, mainly involving chip manufacturing, packaging, and PC manufacturers. Obviously, TSMC is the key target. It is expected that Lisa Su will arrive in Taiwan, in early October, during which he will meet with Wei, CEO of TSMC. The main topic of discussion between the two parties is the future cooperation plan of TSMC’s 3nm and 2nm process nodes, including various available processes. AMD is rumored to be planning to use the N3P process.
In recent years, AMD has achieved remarkable achievements, largely due to TSMC’s very competitive process technology, sufficient production capacity, and good yield. TSMC plans to start mass production of the N2 process in the second half of 2025, and AMD should use it in products in 2026 and beyond.
TSMC will also discuss cooperation with partners on advanced packaging. At present, AMD is already using TSMC’s 3D SoIC platform, such as CoWoS packaging technology and ASE’s FO-EB packaging technology. DigiTimes
said that the frequency of use of AMD products in innovative packaging will continue to increase in the future, and it is necessary to negotiate in advance, negotiate prices and allocate production capacity.
AMD will also discuss ABF substrate issues with supply chain manufacturers, which is one of the main factors restricting EPYC processor shipments. It was reported last year that Lisa Su believed that the investment in this area has been insufficient in the industry, so she will use this opportunity to invest in some substrate production capacity dedicated to AMD. In addition, AMD will also meet with the top leaders of two PC makers, ASUS and Acer.