ADATA applies PCB heat dissipation coating technology to high-frequency memory

As DDR5 memory frequencies soar ever higher, reaching speeds of up to 8000MT/s for numerous high-end products, the issue of thermal management has become increasingly critical. These premium memory modules are almost invariably equipped with heat spreaders, yet the width of these cooling fins is significantly restricted. Even attempts to increase the height of these heat spreaders must be tempered to avoid compromising compatibility. In response to these challenges, Adata has introduced a novel cooling technology capable of effectively reducing temperatures by 10%

Adata’s elite brand, XPG, has pioneered the application of PCB thermal conductive coating technology to overclocked memory modules. This coating not only exhibits excellent thermal conductivity but also provides remarkable stability and insulation. By applying this coating to the memory’s PCB, it enhances the transfer of heat generated by the DRAM chips to the PCB, from where it is dissipated through thermal radiation. This effectively increases the cooling surface area of the memory, thereby achieving superior cooling performance.

The thermal imaging photos of the XPG LANCER NEON 8000MT/s with and without the thermal conductive coating illustrate this point vividly. DDR5 memory without the coating reaches a temperature of 78.5°C under load, whereas the coated memory operates at a significantly cooler 70°C under the same conditions, a reduction of 8.5°C or a decrease of 10.8%, showcasing a substantial improvement in cooling efficiency.

XPG is set to prioritize the application of this innovative PCB thermal conductive coating technology on high-frequency DDR5 memory modules exceeding 8000MT/s. This includes the soon-to-be-launched LANCER NEON RGB and the existing LANCER RGB series, expected to make their debut at Computex 2024 in the second quarter of this year, showcasing this groundbreaking cooling technology.