Xiaomi is rumored to be purchasing 232-layer 3D NAND flash memory

At the 2022 Flash Memory Summit (FMS), Yangtze Memory Technologies Co., Ltd. (YMTC) unveiled its fourth-generation 3D TLC NAND flash chip, the X3-9070, based on the Xtacking 3.0 architecture. Compared to its predecessor, the X3-9070 boasts higher storage density and faster I/O speeds, marking it as the first 200+ layer 3D NAND flash solution to enter the retail market. Currently, the X3-9070 is primarily used in storage products sold domestically, but it is likely to soon feature in devices sold globally.

Last month, Xiaomi held a flagship product launch event, officially announcing the Xiaomi 14 series smartphones. As reported by Business Korea, Xiaomi has procured the 232-layer 3D NAND flash chips from YMTC for use in their latest smartphones. Currently, smartphones mainly utilize 176-layer NAND flash chips, positioning Xiaomi’s new offering as potentially having the strongest storage subsystem in the global smartphone market.

Last year, Xiaomi introduced its first desktop PC, the Xiaomi Mini Host, which incorporated YMTC’s PC300 series SSD, designed specifically for OEMs and featuring the third-generation NAND flash chip based on the Xtacking 2.0 architecture. Given YMTC’s entry into Xiaomi’s supply chain, it would not be surprising to see an expanded collaboration between the two companies.

YMTC currently has at least two types of 232-layer 3D NAND flash chips. Besides the X3-9070, which is a 1Tb 3D TLC NAND flash chip, there is also a 1Tb 3D QLC NAND flash chip used in the new consumer-grade SSD product, the Zhitai TiPro600. Both are built on the Xtacking 3.0 architecture, achieving I/O transfer rates of up to 2400 MT/s.