The IHS of AMD Ryzen 7000 series leak
AMD introduced the Ryzen 7000 series desktop CPUs at Computex 2022. The new generation of Zen 4 architecture products code-named Raphael will use a new AM5 socket (LGA 1718), integrate an RDNA 2 architecture GPU, and support PCIe 5.0 and dual-channel DDR5 memory. Many players are holding coins to buy, and the official listing will wait until “this fall”.
According to TechPowerup, it seems that overclockers have already gotten their hands on a Zen 4 architecture CPU, and they have opened the lid to see the disassembled integrated heat sink (IHS). However, the overclockers did not disclose the situation of the CPU, nor did he show the chip.
As can be seen from the picture, the integrated radiator is fixed by several tentacles, not all-round fixed in the past. The corresponding CPU has two CCDs and one IOD, which is consistent with the Ryzen 7000 series rendering, and there are residues on the surface. From the traces, the chip should be damaged after opening the cover.
In addition to changing the socket type from PGA to LGA, the AM5 socket retains the original 40×40 mm size of the AM4 socket, its pins are also increased to 1718, and there is no capacitor position on the bottom of the CPU. To this end, AMD has cut out the integrated heat sink of the new Ryzen 7000 series desktop CPU to make room for capacitors. This design obviously makes it more difficult to open the processor.
