SEMI expects global 300mm fab capacity to hit a new high in 2026

Recently, the Semiconductor Equipment and Materials International (SEMI), an industry association representing the global electronics product design and manufacturing supply chain, released a new report predicting that by 2026, global 300mm wafer fab capacity will increase to a historic high of 9.6 million wafers per month (WPM). Following robust growth in 2021 and 2022, the expansion of 300mm capacity is expected to decelerate this year due to weakened demand for memory and logic devices.

Ajit Manocha, President and CEO of SEMI, stated that although the global expansion of 300mm wafer fabs is slowing, the industry remains focused on increasing capacity to meet the strong long-term demand for semiconductors. Between 2022 and 2026, SEMI anticipates companies such as TSMC, Samsung, UMC, GlobalFoundries, SMIC, Hua Hong Semiconductor, Intel, SK Hynix, Kioxia, Micron, STMicroelectronics, and Texas Instruments will increase 300mm wafer capacity, with 82 new facilities and production lines commencing operations.

China will concentrate on mature process nodes, raising its global share from 22% in 2022 to 25% in 2026, with 300mm wafer fab capacity reaching 2.4 million wafers per month. Due to sluggish memory market demand, South Korea’s share of 300mm wafer fab capacity will slide from 25% in 2022 to 23% in 2026. Taiwan will maintain its third-place position, albeit with a slight decline in share from 22% in 2022 to 21% in 2026. Japan’s share of 300mm wafer fab capacity is also projected to decrease from 13% in 2022 to 12% in 2026, primarily due to intensified competition from other regions.

Under government-led investment initiatives, coupled with robust demand in the automotive sector, the share of 300mm wafer fab capacity in the Americas, Europe, and the Middle East will experience growth between 2022 and 2026, with the Americas increasing by 0.2% to 9%; Europe and the Middle East’s share will rise from 6% to 7%; Southeast Asia will maintain its share at 4%.

SEMI revealed that capacity growth in the analog and power sectors leads other areas with a compound annual growth rate (CAGR) of 30%, followed by foundry services (12%), optoelectronics (6%), and memory (4%). SEMI has listed a total of 366 facilities and production lines, with 258 in operation and 108 under construction planning.