Pixel 9 Power-Up: New Modem, Satellite Comms
According to Android Authority, Google’s Pixel 9 and Pixel 9 Pro are set to utilize a brand-new Samsung modem, designated as the Exynos 5400, which supports 5G networks. Additionally, Google is actively advancing the implementation of satellite communication features.
While the precise specifications of the Exynos 5400 remain undisclosed, it is expected to be faster and more energy-efficient than its predecessor, the Exynos 5300. The software stack for the Exynos 5400 has been upgraded to offer enhanced stability. Moreover, the Exynos 5400 complies with the 3GPP Release 17 standards, supporting 5G Non-Terrestrial Networks (NTN), which means it is capable of communicating with satellites. This modem will be employed in all products using the Tensor G4 chip, including the Pixel 9/9 Pro and the next-generation Pixel Fold. Additionally, Google is developing a 5G tablet codenamed “clementine” that will also utilize this modem, though the market release date for the tablet remains unclear.
Thanks to the Exynos 5400’s support for NTN, Google’s work on integrating satellite communication features into Android 15 is expected to be completed by the launch of the Pixel 9/9 Pro. Initially, the satellite communication feature will be offered by T-Mobile in collaboration with SpaceX, facilitated through an application called Satellite Gateway that features an SOS emergency communication module. Currently, this feature only allows the sending of text messages and does not support real-time voice calls; sending messages will require users to align their devices with the satellite’s direction, for which Google has specifically designed guidance animations.
In addition to the modem, the SoC of the Pixel 9/9 Pro will also undergo an upgrade. The enhanced Tensor G4 chip, a minor revision of the G3, will continue to use a tri-cluster architecture: the high-performance core will feature the Cortex-X4, the performance cores will use the Cortex-A720, and the efficiency cores will be the Cortex-A520. The GPU is expected to continue with the Immortalis-G715. Regarding packaging technology, the Tensor G4 might utilize Fan-Out Wafer-Level Packaging (FoWLP).
