The pentester's Swiss knife

Complementary FET

Future of Transistors? Intel, TSMC, & Samsung Duel Over CFET Tech

At last week’s IEEE IEDM conference, Intel, TSMC (Taiwan Semiconductor Manufacturing Company), and Samsung showcased their respective CFET (Complementary FET) transistor strategies. The stacked CFET architecture, intertwining both n-type and p-type MOS devices, is...

Intel ExtraSS

Intel Unveils ExtraSS – The Future of Frame Generation?

Last year, Intel introduced its Alchemist (DG2) products at the launch event for its Intel Arc discrete graphics card brand. This debut also featured an artificial intelligence-driven supersampling technology named XeSS. Utilizing Xe-HPG architecture’s...

ExpertBook CX54 Chromebook Plus

Asus Unveils ExpertBook CX54 Chromebook Plus Enterprise

Recently, Intel officially launched the Meteor Lake architecture-based Core Ultra processor. Although the initial products are primarily focused on Windows PCs, Asus has also officially announced the debut of their first Chromebook utilizing the...

Exynos 2400 FoWLP

Samsung Exynos 2400 may benefit from FoWLP packaging

In October this year, Samsung launched its latest generation mobile processor, the Exynos 2400. Building upon the foundation of the Exynos 2200, Samsung implemented several enhancements. Notably, the CPU performance has been boosted by...

TSMC factory Germany A14

TSMC’s 1.4nm production node is officially called A14

Recently, Taiwan Semiconductor Manufacturing Company (TSMC) disclosed at the IEEE International Electron Devices Meeting (IEDM 2023) that the development of its 1.4nm process node is fully underway and progressing smoothly. Additionally, TSMC reemphasized its...