Dimensity 9000+ is an improved version of the current Dimensity 9000, inheriting the technical advantages of the original product. It is still manufactured by TSMC’s 4nm process, and the CPU part is still a 1+3+4 triple-cluster architecture, including one super core (Cortex-X2@3.2 GHz), three large cores (Cortex-A710@2.85 GHz), and four small cores (Cortex-A510). The GPU is a Mali-G710 MC10 with ten cores, which supports the ray tracing technology of the Vulkan API. The Dimensity 9000+ gets a speed bump on its Cortex-X2 high-performance core from 3.05GHz to 3.2GHz. The CPU performance of the Dimensity 9000+ has been improved by 5%, and the GPU performance has been improved by 10%.
In terms of other functions, the Dimensity 9000+ remains unchanged. Its built-in 8MB CPU L3 cache and 6MB system cache, supports 7500 MT/s LPDDR5X memory; integrated fifth-generation AI processor APU 590; supports 3CC carrier aggregation, the download speed of the 5G network reaches 7 Gbps; supports Wi-Fi 6E and 160MHz bandwidth, support Bluetooth 5.3, supports dual-frequency GPS and the new Beidou III-B1C GNSS. It is equipped with Imagiq 790 image signal processor, supports 320MP single camera, as well as three-way 18bit HDR video recording and triple exposure, and supports 8K AV1 video playback.
MediaTek said that smartphones powered by the Dimensity 9000+ are expected to be available in the third quarter of 2022.