Kioxia launches QLC UFS 3.1 embedded flash memory devices
Kioxia has announced a new version of UFS 3.1 embedded flash memory, which will use QLC technology. Kioxia said that current devices such as cutting-edge smartphones have application requirements for high-density storage, and QLC technology can achieve the highest density in a single package.
Kioxia’s UFS proof-of-concept (PoC) device is a prototype with a storage capacity of 512GB, utilizing Kioxia’s own BiCS FLASH 3D flash memory and QLC technology with a storage density of 1Tbit (single die capacity of 128GB). Samples have been provided to OEM customers. Kioxia believes this prototype can meet the increasing performance and density requirements of mobile applications driven by higher-resolution images, 5G networks, 4K video, and more. Kioxia has not disclosed the performance indicators of this QLC UFS 3.1 flash memory for the time being, and the first products to be applied are likely to be smartphones.
Last year, Kioxia said that at this stage, embedded flash memory still urgently needs to improve performance and density. In GB storage devices, UFS is increasingly becoming the preferred solution. In the flash storage market dominated by e-MMC and UFS, nearly 70% of the demand in 2021 will come from UFS and continue to grow.
In the past two years, the demand for semiconductors in the global market has soared, and Kioxia also hopes to seize the opportunity and seek further development.
