Intel, TSMC, AMD and Arm established the open specification UCIe
AMD, Arm, Advanced Semiconductor Engineering, Inc. (ASE), Google Cloud, Intel Corporation, Meta, Microsoft, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company announced the establishment of the open specification UCIe to “defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level.”
The full name of UCIe is Universal Chiplet Interconnect Express, which is an open industry standard designed to establish interconnection at the package level. The UCIe Alliance hopes to establish a global ecosystem supporting chiplet design and foster an open chiplet ecosystem to meet customer demand for customizable package-level integration, connecting chips from multiple suppliers.
At present, the UCIe 1.0 specification has been approved, covering the I/O physical layer, protocol, and software stack from chip to chip, and utilizes two high-speed interconnect standards, PCI Express (PCIe) and Compute Express Link (CXL). The specification builds on the Advanced Interface Bus (AIB), the UCIe standard developed by Intel and donated to the founding members as an open specification. Relevant materials are currently available to UCIe members and can be downloaded from the website.
Sandra Rivera, Executive Vice President, Intel Corporation and GM, Data Center & AI writes:
“Integrating multiple chiplets in a package to deliver product innovation across market segments is the future of the semiconductor industry and a pillar of Intel’s IDM 2.0 strategy. Critical to this future is an open chiplet ecosystem with key industry partners working together under the UCIe Consortium toward a common goal of transforming the way the industry delivers new products and continues to deliver on the promise of Moore’s Law.”
UCIe members said member companies will begin work on next-generation UCIe technology, including defining chiplet form factors, management, enhanced security, and other fundamental protocols.
