Qualcomm released the new Snapdragon X70 baseband
Qualcomm launched a number of new products and technologies at MWC Barcelona, including the Snapdragon X70 5G modem and RF system, FastConnect 7800 mobile connection system, Qualcomm S5 (QCC517x), and Qualcomm S3 (QCC307x) audio platforms.
The Snapdragon X70 is Qualcomm’s fifth-generation 5G modem and RF system that leverages the world’s first 5G AI processor to achieve breakthrough 5G performance. The Snapdragon X70 inherits the 10Gbps downlink rate of the previous generation and supports all 5G commercial frequency bands from 600MHz to 41GHz, provides global frequency band support and spectrum aggregation capabilities, including the world’s first downlink four-carrier aggregation across TDD and FDD spectrum, as well as mmWave and Sub-6GHz aggregation. Snapdragon X70’s extensive, unmatched level of support for global band configurations and spectrum aggregation, as well as global 5G multi-SIM, including Dual-SIM Dual Active (DSDA), allows OEMs to design 5G devices that meet global operator requirements.
The 5G AI processor in the Snapdragon X70 is powered by the Qualcomm 5G AI suite, powered by innovative artificial intelligence, combined with technologies such as Qualcomm 5G PowerSave Gen 3 and Qualcomm QET7100, effectively improving the 5G data transmission speed, coverage and power efficiency of the device, and reduce the signal delay. Qualcomm expects to sample to customers in the second half of 2022, and commercial mobile terminals to ship by the end of 2022.
The FastConnect 7800 mobile connection system is the world’s first Wi-Fi 7 commercial solution. Using dual Wi-Fi radios, it can achieve a channel bandwidth of 320MHz and a peak rate of 5.8Gbps. Qualcomm extends the four-channel dual-band concurrent (DBS) feature to high-frequency bands. Through the 5GHz/6GHz Wi-Fi connection, the two links can work independently at the same time without interfering with each other and with extremely low latency. The new generation of smart Bluetooth dual-channel concurrent technology provides good support for Snapdragon Sound, LE Audio, and Bluetooth 5.3.
Qualcomm S5 (QCC517x) and Qualcomm S3 (QCC307x) are new ultra-low power wireless audio platforms launched by Qualcomm. Both support Snapdragon Sound technology, support dual Bluetooth mode, and combine traditional Bluetooth wireless audio and LE Audio technology. The new platform brings CD-level (16-bit and 44.1kHz) lossless sound quality to wireless headphones for the first time and supports 32kHz ultra-wideband voice. At present, Qualcomm has sampled to customers, and it is expected that commercial terminals will be available in the second half of 2022.
