Intel Arrow Lake CPU modules will have different processes

At this year’s Hot Chips 34 conference, the 14th-generation Core Meteor Lake and subsequent Arrow Lake and Lunar Lake architecture processors were analyzed in detail. Since the 14th generation Core processor Meteor Lake, Intel’s processors have been designed into multi-chip designs, and these chips are packaged together using Foveros 3D packaging technology.

Meteor Lake will include four modules: CPU, GPU, SOC, and IO. The CPU module uses Intel 4 process, while the SOC and IO modules use TSMC 6nm process, and the GPU module uses TSMC 5nm process. These modules are mounted on a passive mid-level that uses Intel’s 22FFL process.

In the 15th generation of Arrow Lake, there may be cases where the desktop and mobile versions of the CPU module use different processes. This is the information disclosed by @OneRaichu, the desktop version of Arrow Lake-S may use TSMC N3 process, while the mobile version of Arrow Lake-P will use the Intel 20A process. All CPU modules are referred to here. If nothing is unexpected, the SOC and IO modules of Arrow Lake should be the same as those of Meteor Lake, and the GPU modules are determined to use the TSMC N3 process. If this information is accurate, then almost the entire desktop version of Arrow Lake will be handed over to TSMC for production.

The desktop versions of Meteor Lake and Arrow Lake will use the LGA 1851 interface. Among them, the P-Core of Meteor Lake is Redwood Cove, E-Core is Crestmont, and Arrow Lake is the P-Core of Lion Cove architecture and the E-Core of Skymont architecture. It is currently known that Arrow Lake will have a maximum of 8P+32E. It is not clear what Meteor Lake will be. It may be 8P+16E like the current Raptor Lake.

The Intel 20A process used in the mobile version of Arrow Lake’s CPU module is actually the original Intel 5nm process. With EUV, next-generation RibbonFET and PowerVia technologies will be used to increase performance per watt by 15%, the plan is to start trial production of the first batch of test wafers in the fab in the second half of 2022, but I don’t know what the current progress is.