Intel announces details of Meteor Lake processors
Intel conducted a detailed analysis of the 14th-generation Core Meteor Lake and subsequent Arrow Lake and Lunar Lake architecture processors at the Hot Chips 34 conference. Starting from the 14th generation of Core, the structure of Intel’s consumer-grade processors will undergo major changes, from the previous single-chip design to multi-chip, and Foveros 3D packaging technology is used to seal these chips together.
There have been previous rumors that Intel intends to use TSMC’s 3nm node on the Meteor Lake GPU module, and the listing has been delayed due to the replacement process, but Intel has always planned to use TSMC’s 5nm process to make this module. Intel introduced Meteor Lake in detail. The CPU consists of four modules, including the CPU module, GPU module, SOC module, and IO module. The CPU module uses Intel 4 process, which is the original 7nm EUV process, while the SOC and IO modules use TSMC 6nm process, and the GPU module uses TSMC 5nm process. The Meteor Lake base tile is different than the one found in Lakefield, which served as an SoC of sorts. The 3D Foveros packaging tech also supports active interposers. Intel says it manufactures the Foveros interposer with its low-cost and low-power-optimized 22FFL process (the same as Lakefield). Intel also has a newer ‘Intel 16’ variant of this node for its foundry services, but it isn’t clear which version Intel will use for the Meteor Lake base tile.
According to Intel’s introduction, Die To Die connections is used between the CPU module and the SOC module, as well as between the SOC module and the GPU module. The above picture is a schematic diagram of Meteor Lake-P. It is obvious that the CPU module has 6 P-Cores and 8 E-Cores. If it is Meteor Lake-U, the CPU module will become 2P+8E, and the desktop-level Meteor Lake-S will have a larger CPU module and a much smaller GPU module.
Intel said that the 14th generation Core Meteor Lake and the 15th generation Core Arrow Lake are both for desktop and mobile platforms, of which the 14th generation Core is planned to be released in 2023, while the 15th generation will be released in 2024. As for the 16th-generation Core Lunar Lake, a 15W low-power processor may be released first, but since there is still a long time before it is released, the schedule may be revised at any time.
Via: tomshardware
