Google’s Tensor G5: TSMC Partnership Confirmed by Database Leak

Earlier reports suggested that Google might change its strategy next year by switching the foundry for the Tensor G5 used in the Pixel 10 series to TSMC’s 3nm process, aligning its manufacturing capabilities with those of Qualcomm and MediaTek. To facilitate this transition, Google plans to expand its R&D center in Taiwan.

According to Wccftech, recently discovered database information indicates that Google has likely commenced its collaboration with TSMC. Any company dealing with import and export must declare the details and value of their goods to customs. The screenshots show relevant database entries, with the exporter being Google’s Taiwanese subsidiary, including the shipment details for the Tensor G5. The product description mentions “LGA,” an abbreviation for “Laguna Beach.”

The shipping list shows that the Tensor G5 chip version is “A0,” and “NPI-OPEN” signifies an early version. The system-level test “SLT” indicates that the SoC has undergone some form of validation. Additionally, the device is equipped with 16GB of memory, which is a reasonable configuration for the Pixel 10 series.

Furthermore, the importer is a company named “Tessolve Semiconductor,” based in India, specializing in semiconductor validation and testing. It appears that Google is sending Tensor G5 samples for validation to potentially save on testing costs.

Although the Tensor G4 has not yet been released, Google is already working on the Tensor G5. Rumors suggest that Google might opt for TSMC’s second-generation 3nm process, known as “N3E,” to produce the Tensor G5 chips, abandoning Samsung’s SoC design in favor of a fully custom solution.