AMD Zen 4 architecture Raphael processor will improve temperature and power management technology
AMD will release Zen 4 architecture processors next year. The processor code-named Raphael will use AM5 sockets, manufactured with TSMC’s 5nm process, and IOD’s are manufactured with 6nm or 7nm process, integrated RDNA 2 architecture core display, provide 28 PCIe Gen4 channels, support dual-channel DDR5-5200 memory, TDP is between 105W-120W, and provide a frequency of about 5GHz.
According to Igor’s Lab, in addition to architecture improvements and performance enhancements, AMD will also further optimize temperature and power management to make it easier to read temperature information and improve power management technology. Compared with rival Intel, AMD’s processors have not done well in these aspects. Through relevant optimization measures this time, the new generation of Ryzen processors should be improved.
Currently in the thermal solution, reporting the CPU temperature is called Tcontrol (Tctl). If Tctl becomes higher, the fan will start to accelerate, if Tctl becomes lower, the fan will slow down to reduce noise. In the Raphael processor, Tctl’s CUR_TEMP (current temperature) output part has been upgraded, there will be a smoother curve, making the fan speed more stable, which helps reduce noise.
Raphael processor may use new power management technology, AMD considered this when designing the AM5 platform. The Raphael processor will avoid sudden power peaks as much as possible, and maintain the maximum efficiency for a period of time as much as possible, and the CPU will maintain as much as possible within the configured TDP.
