AMD may release Ryzen 7000 Raphael Zen 4 CPU at Computex 2022
AMD’s next generation of desktop processors based on the Zen 4 architecture is codenamed Raphael, which belongs to the Ryzen 7000 series, to replace the current Zen 3 architecture Ryzen 5000 series products codenamed Vermeer. According to Wccftech reports, AMD may release Zen 4 architecture Ryzen processors on Computex 2022, which means that it is about a quarter earlier than previous rumors.
![Ryzen 7000 Raphael](https://cdn-0.meterpreter.org/wp-content/uploads/2021/12/AMD-Ryzen-CPU.png)
It has always been reported that the AMD Zen 4 architecture desktop processor will be released between the end of the third quarter and the beginning of the fourth quarter of 2022. This may be related to the pressure of Intel Alder Lake. In addition, Raphael also needs to face competition from Intel’s Raptor Lake, which is the 13th-generation Core.
Ryzen 7000 Raphael will use a brand new AM5 socket (LGA 1718), manufactured with TSMC’s 5nm process, and IOD will use a 6nm process, integrated RDNA 2 core architecture, support PCIe 5.0 and dual-channel DDR5-5200 memory provide a frequency of about 5GHz. In addition to supporting USB 3.2, the new platform may also have native USB 4.0. Raphael’s GPU scale is not large, it may only have 1 or 2 CUs, and there is also news that there will be a maximum of 4 CUs.
At present, there will be at least two 600 series chipsets, namely the flagship-level X670 and the mainstream-level B650. There is no news for the entry-level A620. There have been rumors about the X670 chipset. The X670 chipset will be composed of two B650 PCHs. Because the substrate occupies too much space, it is difficult to use it on Mini-ITX motherboards.
The TDP of the new generation of processors is between 105W and 120W, and the new generation of processors will be divided into six grades of 45W, 65W, 95W, 105W, 125W, and 170W, of which 170W TDP requires a 280-size water-cooled radiator. In addition to architecture improvements and performance enhancements, AMD is rumored to further optimize temperature and power management to make it easier to read temperature information and improve power management technology.