AMD is preparing the X870E chipset to be released alongside the Ryzen 9000 series

Recent reports have indicated that the Zen 5 architecture Ryzen CPUs are slated for release between April and June 2024, to be christened the Ryzen 9000 series. These processors will maintain the same packaging chip design as their Zen 4 counterparts, ensuring compatibility with the AM5 platform, and will continue to offer up to 16 cores and 32 threads.

According to Moore’s Law is Dead, AMD is poised to unveil a new 800 series chipset, designed to complement the Ryzen 9000 series processors, codenamed “Granite Ridge”. The X870E chipset is expected to supplant the current X670E chipset, continuing the use of the AM5 socket. Additionally, it will support the Ryzen 7000 series “Raphael” and the Ryzen 8000 series “Hawk Point” processors.

The primary distinction between the X870E and X670E chipsets pertains to USB4, with AMD mandating motherboard manufacturers to provide USB4 connections at speeds of 40Gbps, positioning the X870E as a tri-chip solution. This includes two Promontory 21 (PROM21) bridge chips and a standalone ASMedia ASM4242 USB4 controller chip. AMD may, in the future, permit the use of USB4 controller chips from other brands, offering more options to motherboard manufacturers. Moreover, AMD is likely to expand the 800 series chipset lineup to include X870, B850, and B840.

It is understood that the CCDs of the Ryzen 9000 series will be fabricated using a 4nm process, while the IOD remains at 6nm. AMD plans to upgrade the memory controller, with DDR5-6400 expected to become the new standard frequency. However, AMD will also enable motherboard manufacturers to support DDR5-8000 EXPO profiles with an FClk of 2400MHz, including a divider. The X870E chipset is set to launch alongside the Ryzen 9000 series, with most 600 series motherboards likely to support the Ryzen 9000 series through BIOS updates.