Raytheon and AMD team up to develop next-generation multi-chip packaging

Raytheon has announced the acquisition of a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) initiative, aimed at developing the next generation of multi-chip packaging for deployment across terrestrial, maritime, and aerial sensors.

TechPowerup reports that under this contract, Raytheon will integrate cutting-edge commercial components from industry collaborators, such as AMD, into a compact package designed to transform radio frequency energy into digital information with enhanced bandwidth and data transfer rates. The resultant integrated system is expected to exhibit superior performance, reduced power consumption, and a lighter weight.

The leadership at Raytheon has stated that collaboration with commercial enterprises enables the rapid incorporation of leading-edge technology into applications for the Department of Defense. Together, they will deliver the inaugural multi-chip package equipped with the latest interconnect capabilities, providing combat personnel with novel system capabilities.

This multi-chip package will utilize the most current industry-standard chip-level interconnect capabilities, enabling peak performance of individual chips and facilitating new system functionalities in an economically efficient and high-performance manner, all while being designed to be compatible with Raytheon’s scalable sensor processing.

AMD, having already adopted multi-chip packaging in its CPU and GPU designs, is well-versed in this application, which is likely one of the reasons for its selection.