More than a year ago, AMD released the Milan EPYC 7003 series processors for data centers and servers. And now there are rumors that AMD is preparing to add their new 3D die stack...
In fact, as early as last year, AMD’s circuit diagram revealed the X3D packaging method. It is a combination of 2.5D and 3D stacking packages, which can package various chips together as compactly as...
Mobile Hacking / Reverse Engineering
apk.sh: makes reverse engineering Android apps easier
December 24, 2024