AMD may provide X3D package for EPYC Milan processor, up to 64 cores
More than a year ago, AMD released the Milan EPYC 7003 series processors for data centers and servers. And now there are rumors that AMD is preparing to add their new 3D die stack technology to the Milan processor, launching a new Milan-X processor.
This time the rumors were sent by hardware leakers ExecutableFix and Patrick Schur. In terms of design, Milan-X will continue to use the Zen 3 architecture and there should be at most 64 cores. These two points are the same as the original Milan series processors. The focus of AMD’s own X3D packaging technology is to provide processors with more than 10 times the bandwidth of the original, so Milan-X processors may use stacked memory chips.
However, even if this rumor is true, it is still unknown what kind of memory AMD will stack for Milan-X. The most likely and the most consensus is HBM. If Milan-X processors do use HBM memory, then their bandwidth will be very amazing.
AMD does not currently have any hints to indicate the existence of Milan-X. Another well-known hardware leaker @momomo_us reportedly found the OPN (Order Part Number) of several Milan-X processors, and these processors will be released under the serial number 7X73.
According to Twitter by @momomo_us, EPYC 7373X (100-000000508) will be 16 cores, 7473X (100-000000507) will be 24C, 7573X (100-000000506) will be 32 cores, and 7773X (100-000000504) will be 64 cores. As for other specifications such as frequency, there is no news for the time being. Among the many Milan-X processors, 7773X is the highest specification and is likely to be used to replace 7763.If the above news is true, then the Milan-X in the X3D package will be AMD’s transition plan to deal with Intel’s next Sapphire Rapids with HBM memory. The real rival to Sapphire Rapids will be the Genoa processor that will be launched in 2022 at the earliest.
Via: tomshardware
