Sony has simplified the cooling system in the new PlayStation 5
Last month, there were media reports that Sony launched a revised version of the PlayStation 5 digital version in Japan. The new version model is CFI-1100B. After comparing Sony’s official manual and quick start guide, compared with the old version of CFI-1000B, CFI-1100B is 300 grams lighter in weight. Due to the larger size of the cooling system in the old version, it is generally speculated that Sony will choose to start in this regard. At the same time, the thumbscrews of the new vertical bracket have also been changed. Users can tighten it by hand without using a screwdriver or a coin, making it more convenient.
According to TechSpot reports, a new batch of PlayStation 5 digital versions has been obtained. After disassembly, it was compared with the old PlayStation 5 digital version. Unsurprisingly, Sony has made changes to the cooling system. The radiator of the new PlayStation 5 digital version is significantly smaller in volume than the old PlayStation 5 digital version, the structure is simplified, and the amount of copper used is also reduced. After testing, the operating temperature of the new model is 3 to 5°C hotter at room temperature of 24°C. This change also has some advantages, that is, the fan noise is reduced. This change also has some advantages, that is, the fan noise is reduced. In addition, on the new version, the Wi-Fi signal has been strengthened.
People generally expect Sony to use new technology on PlayStation 5. It was previously reported that Sony will upgrade the PlayStation 5’s custom SoC to TSMC’s 6nm process around the middle of next year. Compared with the current 7nm process, the transistor density will be increased by 18%, and the same design rules, design infrastructure, SPICE simulation program and IP can be used, which can effectively reduce production and development costs. Maybe then PlayStation 5 will adopt a new appearance, shrink in size, further simplify the cooling system, and become lighter in weight.
